Section 214-4-8 - Loan repayment1. Repayment of loans issued under this Program shall be submitted to the Bond Bank and made in accordance with the terms set forth in the loan agreement executed by the Bond Bank and the successful applicant. All repayments received from borrowers of the program, will be re-deposited into the revolving loan fund and made available for future year funding requests.15- 214 C.M.R. ch. 4, § 8