Ex Parte Zhang et alDownload PDFPatent Trials and Appeals BoardJan 8, 201914094921 - (D) (P.T.A.B. Jan. 8, 2019) Copy Citation UNITED STA TES p A TENT AND TRADEMARK OFFICE APPLICATION NO. FILING DATE FIRST NAMED INVENTOR 14/094,921 12/03/2013 29050 7590 01/10/2019 Thomas Omholt Patent Prosecution Agent CABOT MICROELECTRONICS CORPORATION 870 NORTH COMMONS DRIVE AURORA, IL 60504 Ke Zhang UNITED STATES DEPARTMENT OF COMMERCE United States Patent and Trademark Office Address: COMMISSIONER FOR PATENTS P.O. Box 1450 Alexandria, Virginia 22313-1450 www .uspto.gov ATTORNEY DOCKET NO. CONFIRMATION NO. 100563 3009 EXAMINER DUCLAIR, STEPHANIE P. ART UNIT PAPER NUMBER 1713 NOTIFICATION DATE DELIVERY MODE 01/10/2019 ELECTRONIC Please find below and/or attached an Office communication concerning this application or proceeding. The time period for reply, if any, is set in the attached communication. Notice of the Office communication was sent electronically on above-indicated "Notification Date" to the following e-mail address(es): CMC_PROSECUTION@CABOTCMP.COM thomas_omholt@cabotcmp.com PTOL-90A (Rev. 04/07) UNITED STATES PATENT AND TRADEMARK OFFICE BEFORE THE PATENT TRIAL AND APPEAL BOARD Ex parte KE ZHANG, 1 Michael White, Tsung-Ho Lee, Steven Grumbine, and Hon-Wu Lau Appeal2018-001477 Application 14/094,921 Technology Center 1700 Before MARK NAGUMO, JAMES C. HOUSEL, and DEBRA L. DENNETT, Administrative Patent Judges. NAGUMO, Administrative Patent Judge. DECISION ON APPEAL Cabot ("Zhang") timely appeals under 35 U.S.C. § 134(a) from the Final Rejection2 of all pending claims 1-5, 7, 9-12, 16, and 17. We have jurisdiction. 35 U.S.C. § 6. We reverse. 1 The applicant under 37 C.F.R. § 1.46, and hence the appellant under 35 U.S.C. § 134, is the real party in interest, identified as Cabot Microelectronics Corporation ("Cabot"). (Appeal Brief, filed 31 May 2017 ("Br."), 1.) 2 Office Action mailed O 1 December 2016 ("Final Rejection"; cited as "FR"). Appeal2018-001477 Application 14/094,921 A. Introduction 3 OPINION The subject matter on appeal relates to chemical mechanical polishing ["CMP"] methods and compositions, particularly for nickel phosphorus ["NiP"] surfaces, which are said to be commonly used for rigid disks (hard drives). (Spec. 1 [0001]-[0002].) Prior art CMP compositions for such uses are said to comprise an abrasive, such as silica or alumina, a primary oxidizing agent, such as hydrogen peroxide, and, in some embodiments, a secondary oxidizing agent, typically a metal ion4 such as ferric ion. (Id. at [0002].) The ferric ion catalyst is said to be capable of reversible oxidation and reduction in the presence ofNiP and an oxidizing agent such as hydrogen peroxide. (Id. at 4 [0018].) The prior art is also said to provide chelating additives such as citrate and EDT A to complex the ferric ion and to act to reduce the decomposition rate of the primary oxidizer (hydrogen peroxide) and thus act as a "stabilizer." (Id. at 1-2 [0004].) The pH of these prior art compositions is said to be above 2. 5 However, chelating agents with high ferric ion binding constants are said to reduce the polishing 3 Application 14/094,921, CMP compositions and methods for polishing nickel phosphorous surfaces, filed 03 December 2013. We refer to the '"921 Specification," which we cite as "Spec." 4 The '921 Specification indicates that the art also refers to the metal ion as a "metal catalyst" (Spec. 1 [0004], 1st sentence), and as a "polishing accelerator" (id. at 2 [0004], penultimate sentence). 5 Spec. 2 [0004], discussing Keigo Ohashi, U.S. Patent No. 6,309,434 Bl (2001 ). The '921 Specification also compares its results to Ohashi in Example 4 (Spec. 11-12 [0035], including Table 7), as discussed infra. 2 Appeal2018-001477 Application 14/094,921 removal rates [ofNiP], which is contrary to the critical requirement for high removal rates to maximize manufacturing throughput. (Id. at [0005].) Zhang seeks patent protection for a CMP method in which the pH is less than 1.5, the catalyst stabilizing agent is malonic acid [H2C(COOH)2] in a certain range of concentration both in the solution and relative to the metal ion, and glycine [H2NCH2COOH] as a nickel complexing agent. Such compositions are said to "improve oxidizer stability without significantly compromising NiP material removal rates for ferric ion-catalyzed CMP slurries." (Id.) The '921 Specification speculates that the Ni complexing agent "aids in Ni removal by complexing with nickel ions formed during the polishing process." (Id. at 4 [0017].) Support for this hypothesized role of glycine in a low pH (pH 1.8) polishing process (in the absence of an iron catalyst as a secondary oxidizing agent) is indicated in Example 1, Table 1, which shows slurry S2 (glycine) providing the highest rate of removal (RR= 17 .39 mg/min) of all Ni complexing agents (slurry S8 provides a control without a nickel complexing agent, RR= 9.96 mg/min). (Spec. 8.) As indicated in Table 2, the enhancing role of glycine continues with and without iron catalyst. (Id. at 9.) As shown in Table 5, high rates of removal ("RR") also are obtained at low pH (pH 1.3) with glycine as a nickel complexing agent, but without malonic acid as a catalyst stabilizer. (Id. at 10.) But, as shown in Figure 1 (not reproduced here), increased metal catalyst (Fe) concentration results in decreased oxidizer (hydrogen peroxide) concentration with time if malonic acid is not present as a catalyst stabilizer. (Id. at 9-10 [0033].) 3 Appeal2018-001477 Application 14/094,921 Example 3 provides a comparison of oxalic acid [(COOH)2] and malonic acid as catalyst stabilizing agents in the presence of 100 ppm Fe and 0.6 w% glycine at pH 1.5. (Id. at 10-11 [0034].) As shown in Figure 2, not reproduced here, oxalic acid ( dashed lines) provides better oxidative stabilization than malonic acid (solid lines), "likely due to a stronger complexation with iron." (Id. at 10 [0034].) However, as shown in Figure 3, shown below, ,,,~------~---············· . - . ........................... • •• • muL , , '•"•"•"•",".".',•,•,•,•,•n••"'i'•• , ••••• •.•.•.•.•,•,•,•,•,•,•,•,•,•,•,•••••••••• ••••,•,•,",",",•,•,•,•,•,•,•,•,•,•,•,• • •, , , , • • ••",",",-,",","" h • • • •• • • •~~• • •, ,\\\'".",",",._ ...... h"."'F, . "'"''""'"-.-.-.-.-.-.•.•••••••••·a,,•,ss"-.-.""-.-.-.•.•.•~,Ji,."JI"'"'-'•'•'•''''"''''"'·'·'"'' ... ,,, ... -.-.-. .. -.-.-.-.-.-..•.•.••• '•'•'•'''''''"'"""""""'-'""""""" {Figure 3 shows the removal rate ("RR") with catalyst stabilizer: at t = 0, the RR with malonic acid as the stabilizer, is higher than the control, while the RR with oxalic acid as the stabilizer is lower than the control} oxalic acid (solid lines) reduces the fresh pot removal rate (Day 0), relative to control S 1 E ( dotted line), in contrast to malonic acid ( dashed lines), which does not reduce the initial removal rate. This result is said to be "surprising[]." (Id. at 11 [0034].) In Example 4 (Spec 11-12 [0035]), the initial removal rate (at O days, RR= 17.99 mg/min) obtained with malonic acid at pH 1.3 (adjusted with nitric acid, HNQ3) is significantly higher than the initial RR of 10.9 mg/min obtained with malonic acid at its natural pH 2.6 (i.e., pH not adjusted with 4 Appeal2018-001477 Application 14/094,921 nitric acid). (Id. at 12, Table 7.) At both lower and higher pH, the rates of removal with malonic acid remain relatively high (RR= 17.55 mg/min and 11.18 mg/min, respectively) after 166 hr. Citric acid, used as a stabilizer, also shows an enhanced removal rate (17 .36 mg/min) at pH 1.3 (compared to RR= 13.37 mg/.ml at pH 2.7), but after 166 hours, the RR falls to 15.95 mg/hr. Thus, malonic acid is said to be a more effective catalyst stabilizing agent than citric acid, contrary to the results reported by Ohashi. (Id. at 11 [0035], last sentence.) Sole independent claim 1 is representative and reads: A chemical mechanical polishing (CMP) method for planarizing a nickel phosphorus (NiP) substrate, the method comprising abrading a surface of the substrate with a CMP composition; the CMP composition comprising a particulate abrasive suspended in an aqueous carrier having a pH of less than 1.5, and containing an oxidizing agent comprising hydrogen peroxide, a metal ion catalyst capable of reversible oxidation and reduction in the presence ofNiP and the oxidizer, a catalyst stabilizing agent, and a Ni complexing agent, wherein the Ni complexing agent is glycine; wherein the catalyst stabilizing agent is malonic acid, and wherein the catalyst stabilizing agent is present in the CMP composition at a concentration of about 0.04 to about 0.2 wt% and present in a molar concentration of 2 to 5 times the metal ion molar concentration. (Claims App., Br. 7; some formatting, and emphasis added.) 5 Appeal2018-001477 Application 14/094,921 The Examiner maintains the following ground of rejection: 6, 7 Claims 1-5, 7, 9-12, 16, and 17 stand rejected under 35 U.S.C. § 103 in view of the combined teachings of Chinnathambi 'O 16, 8 Chinnathambi '470, 9 Small, 10 and Streinz. 11 B. Discussion The Board's findings of fact throughout this Opinion are supported by a preponderance of the evidence of record. We find that Zhang focuses arguments for patentability based on limitations recited in claim 1. We likewise focus our attention on that claim. Briefly, the Examiner finds (FR 2-3, ,r 6) that Chinnathambi '016 describes a CMP composition for NiP disks comprising particulate abrasives in an aqueous carrier having "any suitable pH" paragraph [0023], and, in paragraph [0021 ], glycine as a complexing agent for nickel. 12 The Examiner 6 Examiner's Answer mailed 22 September 2017 ("Ans."). 7 Because this application was filed after the 16 March 2013, effective date of the America Invents Act, we refer to the AIA version of the statute. 8 Selvaraj Palanisamy Chinnathambi and Haresh Siriwardane, Polishing composition for nickel-phosphorous memory disks, U.S. Patent Application Publication 2010/0308016 Al (2010) (assigned to Cabot). 9 Selvaraj Palanisamy Chinnathambi and Haresh Siriwardane, Polishing composition for nickel-phosphorous memory disks, U.S. Patent Application Publication 2010/0193470 Al (2010) (assigned to Cabot). 10 Robert J. Small and Brandon S. Scott, Catalytic composition for chemical- mechanical polishing, method of using same, and substrate treated with same, U.S. Patent Application Publication 2004/0029495 Al (2004). 11 Christopher C. Streinz et al., Composition and method for polishing rigid disks, U.S. Patent No. 6,015,506 (2000) (assigned to Cabot). 12 Chinnathambi 'O 16 describes complexing agents as materials that "affect the dispersion of the particles in the polishing composition, and thus 6 Appeal2018-001477 Application 14/094,921 finds that Chinnathambi 'O 16 neither discloses the use of a metal ion catalyst or a catalyst stabilizing agent (and the amounts required), nor that the pH is desirably less than 2. (FR 3, ,r 7.) The Examiner finds that Streinz discloses a CMP composition with a metal ion catalyst capable of reversible oxidation and reduction, as recited in the claim, and concludes that it would have been obvious to include the metal catalyst in the composition disclosed by Chinnathambi 'O 16 for the disclosed purpose as an aid in polishing. (Id. at ,r 9.) The Examiner finds (id. at 4, ,r 10) that Small discloses, in paragraph [0038], CMP compositions comprising metal ion catalysts and oxidizing agents, and that catalyst stabilizing agents, including malonic acid, may be present at concentrations of about 0.001 to about 2 weight percent of the composition, which encompass the range of about 0.04 to about 0.2 wt% required by claim 1. The Examiner reasons that, because the general conditions of the CMP process were known, it would have required no more than routine experimentation to determine the optimum or workable conditions, and concludes that the amounts of stabilizer would have been obvious. (FR 4, ,r 10, citing In re Aller, 220 F.2d 454,456 (CCPA 1955).) Finally, the Examiner finds that Chinnathambi '470 discloses CMP for NiP influence the removal rate, microwaviness, and edge roll-off of a substrate polished with the polishing composition." (Chinnathambi '016 [0021].) Glycine, in particular, is thought to result in "improved microwaviness of the disk." (Id.) (The term "microwaviness" refers to wavelengths of the roughness of the surface of a disk that are on the order of the length of the transducing [i.e., the writing or reading] head, said to be in the range of 10 to 5000 microns. (Id. at [0003].)) Zhang does not object to the Examiner's characterization, which we do not find unreasonable, given that the '921 Specification indicates that Ni ions are formed during the polishing process, and glycine, if present, would have been expected to complex with those ions, regardless of the reason Chinnathambi 'O 16 puts it into the slurry. 7 Appeal2018-001477 Application 14/094,921 disks using a particulate abrasive in an aqueous carrier having a pH in the range of about 1 to about 5. (Id. at 5---6, ,r 12.) The Examiner concludes that the encompassed range of pH less than 2, required by claim 1, would have been obvious as a matter of routine experimentation based on a reasonable expectation of success. (Id.) Zhang argues that the Examiner erred harmfully because the prior art relied on does not disclose the "general conditions for the present claims." (Br. 5, 2d para.) More particularly, Zhang urges that Small discloses catalysts that are coated on the abrasive particles, rather than in solution. (Br. 3, last para.) This means, according to Zhang, that "the concentration and ratio of the stabilization agent is not particularly important." (Id. at 4, penultimate sentence.) Zhang argues further that Small's disclosure of a general range relates to all possible additives, not just to catalyst stabilizing agents. (Id. at 5, 2d para.) Moreover, in Zhang's view, Small does not provide sufficient teachings to recognize the presence of stabilizer as a result effective variable to guide optimization by routine experimentation. (Id.) In this regard, Zhang observes that Small does not provide any examples of CMP compositions comprising a stabilizing agent. (Id.) Zhang urges that Chinnathambi '470 does not teach any pH effect on the CMP process, and further that the '921 Specification shows that oxalic acid and malonic acid have distinct behaviors with changing pH. (Id. at 3rd para.) Moreover, Zhang urges that the teachings of Chinnathambi '470 are limited to CMP compositions containing oxalic acid and optionally tartaric acid as stabilizers, to obtain CMP compositions have lower chemical oxygen 8 Appeal2018-001477 Application 14/094,921 demand. 13 (Id. at 3, 3rd full para., and at 4, 3rd para.) Thus, in Zhang's view, extending Chinnathambi '470's teachings regarding a pH range of pH 1-5 to the hypothesized CMP said to be obvious in view of Chinnathambi 'O 16, Streinz, and Small, is not supported reasonably by evidence of record. Zhang also criticizes the combination of the teachings of Small with those of Chinnathambi 'O 16 as lacking motivation, given Small's interest in high polishing rates (enhanced by the presence of the metal ion catalyst), and Chinnathambi 'O 16' s primary interest in improved micro waviness, not increased polishing rates. (Id. at 5, 4th para.) Reviewing the record, we conclude that the Examiner has not established a prima facie case of obviousness. The concerns of Chinnathambi '016 with improved [i.e., diminished] microwaviness and of Chinnathambi '470 with water purity make striking the absence of recommendations that well-known metal ion catalysts be used in the disclosed CMP compositions of these patents. Moreover, the focus of Chinnathambi '470 on oxalic acid, or oxalic acid in combination with tartaric acid, without more, limits the applicability of its teachings regarding pH ranges of from 1 to 5. The Examiner has not directed our attention to evidence in the present record that would have prompted an investigation of the slurries having a pH below 2 in the CMP slurries of Chinnathambi 'O 16 modified to contain metal ion catalysts as taught by Streinz and by Small. 13 Chinnathambi '4 7 0 teaches that " [ o ]ne measure of water quality is known as chemical oxygen demand ... a measure of the amount of oxygen required to fully oxidize organic material in a waste stream to carbon dioxide, ammonia, and water." (Chinnathambi '470 [0003].) 9 Appeal2018-001477 Application 14/094,921 Indeed, the express teachings of Small are limited to a pH range of 2 to 7. The Examiner's determination that "such pH of about 2 is sufficiently close to Appellant's pH of 1.5" (Ans. 4, 1. 3), is a finding of fact that lacks credible supporting evidence in the record that a factor of about three 14 in hydrogen ion concentration would have been regarded as "sufficiently close" in this art to yield predictable results at pH values less than recommended by Small. These concerns are intensified by the distinct character of the catalysts described by Small, which are heterogeneous-present only on the surfaces of the abrasive particles 15-rather than in solution, like the soluble ferric nitrate salts exemplified by Streinz in Examples 3 and 4 (Streinz, cols. 11- 12.) Finally, there appears to be no indication in the prior art that markedly improved removal rates might be obtained in solutions having pH less than 1.5 compared to non-adjusted pH values of about 2.6 (see Table 7, Spec. 12). 16 Thus, there appears to be no basis to determine that the general conditions of the reaction were sufficiently well-known, prior to Zhang's 14 pH is defined as the negative of the logarithm of the hydrogen ion concentration: pH= -log[H+]. Thus, a difference of 0.5 pH units is a factor of 10°·5 = v'lO :::::; 3. 15 We decline to credit Zhang's more specific arguments, mentioned supra at 8, first full para., as Zhang has not supported these arguments with citation to authority of record. 16 It has not escaped our notice that Small teaches that "the preferred [pH] levels, are believed to facilitate control of the CMP process. A composition having a pH that is too low, such as below pH 2, may present problems in terms of the handling of the composition and the quality of the polishing itself." (Small 4 [0033], emphasis added.) 10 Appeal2018-001477 Application 14/094,921 work described in the '921 Specification, to allow a reasonable expectation that the improved results would have been achieved or predicted. Accordingly, we are persuaded of harmful error in the appealed rejection, and we reverse. C. Order It is ORDERED that the rejection of claims 1-5, 7, 9-12, 16, and 17 is reversed. REVERSED 11 Copy with citationCopy as parenthetical citation