Ex Parte Prather et alDownload PDFPatent Trial and Appeal BoardSep 19, 201210930590 (P.T.A.B. Sep. 19, 2012) Copy Citation UNITED STATES PATENT AND TRADEMARK OFFICE ____________________ BEFORE THE PATENT TRIAL AND APPEAL BOARD ____________________ Ex parte ZACHARY A. PRATHER, STEVEN E. REDER, and MICHAEL J. BERMAN ____________________ Appeal 2011-000265 Application 10/930,590 Technology Center 1700 ____________________ Before ROMULO H. DELMENDO, JEFFREY B. ROBERTSON, and RAE LYNN P. GUEST, Administrative Patent Judges. GUEST, Administrative Patent Judge. DECISION ON APPEAL I. STATEMENT OF CASE Appellants appeal under 35 U.S.C. § 134 from the Examiner’s decision to reject claims 15, 16, and 18 under 35 U.S.C. § 103(a) as unpatentable over Johnson1 and Kucherov2 and claim 17 under 35 U.S.C. § 1 US Patent 6,278,049 B1, issued Aug. 21, 2001, to Johnson et al. 2 US Application Publication 2003/0033818 A1, published Feb. 20, 2003, naming Kucherov et al. as inventors. Appeal 2011-000265 Application 10/930,590 2 103(a) as unpatentable over Johnson, Kucherov and Mansuria3. We have jurisdiction under 35 U.S.C. § 6(b). We REVERSE. Appellants’ invention relates to a device and method of converting heat generated by a semiconductor device into electric power (Spec. 2:2-4). Claim 15 is illustrative (indentations and bracketed numbers added for clarity): 15. A thermoelectric generator device comprising: a top layer [1]; a bottom layer [2]; a first electrical conductor, thermal insulator layer [3] in contact with said top layer [1]; a second electrical conductor, thermal insulator layer [4] in contact with said bottom layer [2] wherein both the first and second electrical conductor, thermal insulator layers [3,4] are disposed between said top and bottom layers [1,2]; a p-type material [5] between the first and second electrical conductor, thermal insulator layers [3,4]; an n-type material [6] between the first and second electrical conductor, thermal insulator layers [3,4]; and an electrical and thermal insulating layer [7] between the p-type material [5] and the n-type material [6], wherein a first end of said electrical and thermal insulating layer [7] between the p-type material and the n-type material contacts the first 3 US Patent 5,032,897, issued Jul. 16, 1991, to Mansuria et al. Appeal 2011-000265 Application 10/930,590 3 electrical conductor, thermal insulator layer [3] and does not contact the top layer [1], and wherein a second end of said electrical and thermal insulating layer [7] between the p-type material and the n-type material contacts the second electrical conductor, thermal insulator layer [4] as well as the bottom layer [2], thereby providing an electrical separation within the second electrical conductor, thermal insulator layer [4], wherein each of said top and bottom layers [1,2] comprise an electrical insulator, thermal conductor layer which is non-electrically conductively contactable with a device, and said thermoelectric generator device is configured to covert heat generated by the device into electric power. II. DISCUSSION A. ISSUE ON APPEAL The dispositive issue on appeal arising from the findings and determinations of the Examiner and the contentions of Appellants is: does the evidence support the Appellants’ argument that the Examiner erred in concluding that a person of ordinary skill in the art would have arrived at a structure having an electrical and thermal insulating layer [7] between the p- type material and the n-type material with a first end that contacts a first electrical conductor, thermal insulator layer [3] but not the top layer [1] and a second end that contacts a second electrical conductor, thermal insulator layer [4] and a bottom layer [2] in view of the cited prior art references? We answer this question in the affirmative. App App B. therm semi and c the c botto type teach cons inven Figu eal 2011-0 lication 10 ANALY Figure 1 Fi oelectric conductin ol. 15, ll. laimed top m layer [2 and p-type es an insu titutes the tion (Ans res 7, 11a- 00265 /930,590 SIS 7of Johnso gure 17 de device wit g materials 35-43). T layer [1], ], and sem materials lating mat electrical . 9) (see e. 11c, and 1 n is repro picts an el h a wire b 105,106 he Examin electronic iconducti [5,6] (An erial 11 (n and therma g. Johnson 4). 4 duced belo evational onded chip in a linear er finds th package ng lines 10 s. 4). The ot shown l insulatin , col. 11, w. cross-secti 114 and design (Jo at base pl 117 consti 5/106 con Examiner in Figure 1 g layer [7 ll. 4-45, co onal view alternating hnson, col ate 100 co tutes the c stitute the finds that 7 above) t ] of the cla l. 14, ll. 1 of a . 9, ll. 3-5 nstitutes laimed claimed n Johnson hat imed 3-24, and - App App state Exam and I insul legs layer KUC into have mate legs wou subs eal 2011-0 lication 10 Figure 4 Figure 4 supercond iner finds B1, that co ator layers and the oh The Exa s, or the e HEROV r the device the claim rial [7]] w [105,106 i Appellan ld not mee tantially re 00265 /930,590 .12 of Kuc .12 depict ucting the that Kuch nstitute fi [3,4], are mic conta miner dete lectrical co eference, of FIG. 17 ed structur as applied n Johnson ts contend t the limita constructe herov is re s an elevat rmionic re erov teach rst and sec disposed ct of the he rmines tha nductor th and the co of the JO e “as [the between o ] suggeste that mod tion of cla d or impro 5 produced ional cross frigerator es that top ond electr “between t at sink/so t “the incl ermal insu mbination HNSON r electrical c hmic cont d by KUC ifying the im 15, wi per hinds below. -sectional (Kucherov and botto ical condu he alterna urce” (An usion of th lator mat of the ins eference a onductor, acts [235] HEROV” device dis thout the d ight (App. schematic , ¶ [0205] m barrier ctor, therm ting semic s. 5). e potentia erial layer ulator mat re interpre thermal in and semic (Ans. 9). closed by evice bein Br. 6-7). of a solid ). The layers B1 al onductor l barrier s [7] of the erial 11 ted to” sulator onductor Johnson g Appeal 2011-000265 Application 10/930,590 6 We fail to see how the inclusion of insulating material along the entire open space between the semiconductor legs 105/106, as taught by Johnson along with the incorporation of the barrier layers disclosed in Kucherov, would form a structure in which the insulating material would contact the bottom layer 117 but not the top layer 100. Kucherov only teaches adding the top and bottom barrier layers B1 and IB1 between the n-type and p-type material (105/106 of Johnson’s Figure 17) and the top and bottom layers (100/117 of Johnson’s Figure 17). Therefore, even including the barrier layers B1 and IB1 as taught by Kucherov, when the insulating layer 11 is added in the entire open space between semiconductor legs 105/106, it would necessarily contact the top layer 100 in each open space to the right of legs 106 and to the left of legs 105 in the structure of Figure 17 of Johnson. Similarly, the added insulation layer 11 would contact the bottom layer 117 in each open space to the left of legs 106 and to the right of legs 105 in Figure 17 of Johnson. The Examiner has not sufficiently explained why one of ordinary skill in the art would have extended the barrier layers B1 to the open space between the semiconductor material legs 105 and 106 of Johnson adjacent the top layer 100, and similarly would not have extended barrier layer IB1 to the open space adjacent the bottom layer 117, such that the added insulating material 11 would contact barrier layers B1 and IB1 and bottom layer 117, but not top layer 100. Indeed, Figure 4.12 of Kucherov also appears to show similar open spaces between the n-type and p-type materials and adjacent the top and bottom layers, which are devoid of barrier layers B1 and IB1. The Examiner has not adequately explained how one of ordinary skill in the art would have arrived at a structure in which an electrical and thermal Appeal 2011-000265 Application 10/930,590 7 insulating layer [7] between the p-type material [5] and the n-type material [6] of Johnson would have contacted the first and second electrical conductor, thermal insulator layers [3, 4] and the bottom layer [2] but not the top layer [1], as recited in claim 15. See In re Rouffet, 149 F.3d 1350, 1358 (Fed. Cir. 1998) (“hindsight” is inferred when the specific understanding or principal within the knowledge of one of ordinary skill in the art leading to the modification of the prior art in order to arrive at appellant's claimed invention has not been explained). The Examiner relies on the same rationale in rejecting each of the claims, including separately rejected claim 17 (Ans. 4-8). III. CONCLUSION On the record before us and for the reasons discussed above, we reverse the rejections maintained by the Examiner. REVERSED Copy with citationCopy as parenthetical citation