Applied Materials, Inc.Download PDFPatent Trials and Appeals BoardMar 27, 202014610489 - (D) (P.T.A.B. Mar. 27, 2020) Copy Citation UNITED STATES PATENT AND TRADEMARK OFFICE UNITED STATES DEPARTMENT OF COMMERCE United States Patent and Trademark Office Address: COMMISSIONER FOR PATENTS P.O. Box 1450 Alexandria, Virginia 22313-1450 www.uspto.gov APPLICATION NO. FILING DATE FIRST NAMED INVENTOR ATTORNEY DOCKET NO. CONFIRMATION NO. 14/610,489 01/30/2015 Lai ZHAO 021181USA 6352 44257 7590 03/27/2020 PATTERSON & SHERIDAN, LLP - - APPLIED MATERIALS 24 GREENWAY PLAZA SUITE 1600 HOUSTON, TX 77046 EXAMINER CHEN, KEATH T ART UNIT PAPER NUMBER 1716 NOTIFICATION DATE DELIVERY MODE 03/27/2020 ELECTRONIC Please find below and/or attached an Office communication concerning this application or proceeding. The time period for reply, if any, is set in the attached communication. Notice of the Office communication was sent electronically on above-indicated "Notification Date" to the following e-mail address(es): Pair_Eofficeaction@pattersonsheridan.com psdocketing@pattersonsheridan.com PTOL-90A (Rev. 04/07) UNITED STATES PATENT AND TRADEMARK OFFICE BEFORE THE PATENT TRIAL AND APPEAL BOARD Ex parte LAI ZHAO, GAKU FURUTA, QUNHUA WANG, ROBIN L. TINER, BEOM SOO PARK, SOO YOUNG CHOI, and SANJAY D. YADAV Appeal 2019-000413 Application 14/610,489 Technology Center 1700 Before N. WHITNEY WILSON, BRIAN D. RANGE, and LILAN REN, Administrative Patent Judges. RANGE, Administrative Patent Judge. DECISION ON APPEAL Appeal 2019-000413 Application 14/610,489 2 STATEMENT OF THE CASE Pursuant to 35 U.S.C. § 134(a), Appellant1 appeals from the Examiner’s decision to reject claims 11–20. We have jurisdiction under 35 U.S.C. § 6(b). We REVERSE. CLAIMED SUBJECT MATTER2 Appellant’s Specification describes plasma deposition shadow frame spoilers. Plasma enhanced chemical vapor deposition (PECVD) is a known way of depositing thin films on a substrate for a flat panel display or a semiconductor wafer. Spec. ¶ 3. During such a process, a shadow frame may be placed over the periphery of the substrate to prevent unwanted deposition on the support that holds the substrate. Id. ¶ 20 (describing Figure 1 which Appellant labeled as “prior art”). Deposition rates may be too high on corner or edge regions of a substrate (a problem, for example, when depositing on a panel for a large LCD or flat panel display). Id. ¶¶ 3–7. Appellant describes use of a “corner spoiler” situated on the shadow frame that decreases high deposition rates on corner or edge regions. Id. ¶¶ 7, 26, Fig. 2. Claim 11, reproduced below with emphasis added to recitations key to this appeal, is illustrative: 1 We use the word “Appellant” to refer to “applicant” as defined in 37 C.F.R. § 1.42. Appellant identifies the real party in interest as Applied Materials, Inc. Appeal Br. 3. 2 In this Decision, we refer to the Non-Final Office Action dated May 4, 2018 (“Non-Final Act.”), the Appeal Brief filed August 13, 2018 (“Appeal Br.”), the Examiner’s Answer dated September 14, 2018 (“Ans.”), and the Reply Brief filed October 18, 2018 (“Reply Br.”). Appeal 2019-000413 Application 14/610,489 3 11. A shadow frame for a processing chamber comprising: a rectangular shaped body having a rectangular opening therethrough, an inside edge and an outside edge; and one or more corner spoilers coupled to a top surface of the rectangular shaped body at one or more corners of the rectangular shaped body and disposed within an area bounded by the inside edge and the outside edge of the rectangular shaped body, wherein the one or more corner spoilers comprises: an L-shaped body fabricated from a dielectric material, wherein the L-shaped body is configured to change plasma distribution at a corner of a substrate in the processing chamber, and wherein the L-shaped body comprises: a first leg has an end with an inside corner and an outside corner; and a second leg has an end with an inside corner and an outside corner, wherein the first and second legs meet at an inside corner and an outside corner of the L-shaped body. Appeal Br. 17 (emphasis added). The second independent claim on appeal, claim 13, similarly recites corner spoilers and the coupling and disposition of the spoilers. Id. at 18. REFERENCES The Examiner relies upon the prior art below in rejecting the claims on appeal: Name Choi et al. (“Choi”) Koshiishi et al. (“Koshiishi”) Ishibashi et al. (“Ishibashi”) Yang et al. Reference US 2006/0228496 A1 US 2007/0169891 A1 US 2007/0264441 A1 US 2011/0053356 A1 Date Oct. 12, 2006 July 26, 2007 Nov. 15, 2007 Mar. 3, 2011 Appeal 2019-000413 Application 14/610,489 4 (“Yang”) Liu et al. (“Liu”) Kim Cho et al. (“Cho”) US 2011/0304086 A1 US 2014/0158046 A1 KR 10-0903306 Dec. 15, 2011 June 12, 2014 June 10, 2009 REJECTIONS The Examiner maintains3 the following rejections on appeal: A. Claims 11–12 under 35 U.S.C. § 103 as obvious over Cho in view of Koshiishi, and Ishibashi. Ans. 3. B. Claims 13, 14, and 16–18 under 35 U.S.C. § 103 as obvious over Cho in view of Liu, Koshiishi, and Ishibashi. Id. at 6. C. Claim 15 under 35 U.S.C. § 103 as obvious over Cho in view of Liu, Koshiishi, and Ishibashi further in view of Kim. Id. at 9. D. Claim 19 under 35 U.S.C. § 103 as obvious over Cho in view of Liu, Koshiishi, and Ishibashi further in view of Choi. Id. at 10. E. Claim 20 under 35 U.S.C. § 103 as obvious over Cho in view of Liu, Koshiishi, Ishibashi, and Choi further in view of Yang. Id. OPINION The Examiner has the initial burden of establishing a prima facie case of obviousness under 35 U.S.C. § 103. In re Oetiker, 977 F.2d 1443, 1445 (Fed. Cir. 1992) (“[T]he examiner bears the initial burden, on review of the prior art or on any other ground, of presenting a prima facie case of 3 The Examiner provides reasoning in the Answer that the Examiner designates as a new ground of rejection. Ans. 11–13. Appeal 2019-000413 Application 14/610,489 5 unpatentability.”). To establish a prima facie case of obviousness, the Examiner must show that each and every limitation of the claim is described or suggested by the prior art or would have been obvious based on the knowledge of those of ordinary skill in the art or the inferences and creative steps a person of ordinary skill in the art would have employed. In re Fine, 837 F.2d 1071, 1074 (Fed. Cir. 1988); KSR Int’l Co. v. Teleflex Inc., 550 U.S. 398, 417 (2007). To resolve the issues before us on appeal, we focus on the Examiner’s findings and determinations that relate to the error Appellant identifies. Ans. 3 (citing Cho). In particular, the Examiner finds that Cho (which the Examiner refers to as ’306) teaches shield material 260 which the Examiner equates to the rectangular shaped body of Appellant’s claims 11 and 13. The Examiner equates Cho’s “holding surface extension part 240” to the recited “one or more corner spoilers” of claims 11 and 13. Id. at 4. The Examiner finds that Cho does not teach that the corner spoiler is coupled to the top surface of the rectangular shaped body or disposed within the edges of the body. Id. The Examiner finds, however, that Koshiishi (which the Examiner refers to as ’891) teaches a focus ring with a lower member 9 that can be adjusted to affect impedence and plasma level. Id. at 4–5 (citing Koshiishi). The Examiner also finds that Ishibashi (which the Examiner refers to as ’441) teaches that use of a hanging portion 21 can be used to “control the concentration degree of the electric field.” Id. at 5 (citing Ishibashi). The Examiner provides further reasoning as a new ground of rejection where the Examiner finds that Koshiishi and Ishibashi teach that the “thickness, width, and location of the protruding portion of the dielectric Appeal 2019-000413 Application 14/610,489 6 material affects the electric field and plasma.” Id. at 11–12 (citing Koshiishi and Ishibashi). The Examiner concludes that it would have been obvious to rearrange Cho’s extension part 240 to the top of shield material 260 to reduce plasma edge effect. Id. at 5, 12. Appellant argues that the Examiner improperly relies on hindsight to move Cho’s extension part 240 so that it would be both attached to the rectangular shaped body of the shadow frame and bounded by the edges of the rectangular shaped body of the shadow frame. Appeal Br. 7–10. Appellant’s argument persuades us of reversible error. Appellant argues that Cho arranged its extension part 240 to address an edge effect generated by a vertex of the substrate. Appeal Br. 8. Because the record only includes a machine translation of Cho, the portions of Cho cited by Appellant are unclear. See Cho 6. This lack of clarity weighs against the Examiner; because of the unclear translation, we cannot determine that a preponderance of the evidence indicates that the extension part 240 of Cho could be rearranged without disrupting Cho’s purpose. Meanwhile, Koshiishi teaches a focus ring 8 that serves to prevent plasma from reaching the backside surface of the end portion of the semiconductor wafer W. Appeal Br. 9–10; Koshiishi Fig. 2, 17, ¶¶ 74–76. Ishibashi teaches a protruding portion 24 that hangs well above the substrate that is being worked on. Appeal Br. 11; Ishiibashi Fig. 5, ¶¶ 72–73. None of the references individually teach or suggest an L-shaped spoiler “coupled to a top surface of a rectangular shaped body at one or more corners” and “disposed within an area bounded by the inside edge and the outside edge of the rectangular shaped body” as claims 11 and 13 recite. Moreover, the Examiner has not persuasively explained why a person of skill in the art Appeal 2019-000413 Application 14/610,489 7 would modify Cho based upon the quite different teachings of Koshiishi or Ishiibashi to reach these recitations. For an obviousness conclusion to be proper, the Examiner must establish a reason why a person of skill in the art would reach the recited spoiler coupling and location. One way the Examiner could meet this burden is by a result effective variable rationale: “discovery of an optimal value of a result effective variable in a known process is ordinarily within the skill of the art.” In re Boesch, 617 F.2d 272, 276 (CCPA 1980). Here, while the references may collectively teach that geometry of the wafer processing area affects the electric field, plasma, and, thus, thickness of coatings on the substrate (see, e.g., Ans. 12), we do not agree that this is sufficient for the location of Cho’s extension part 240 to be merely a result effect variable. Determining geometry is not merely discovery of an optimal value that would necessarily be within the ordinary skill of the art. Rather, the references as a whole suggest that a wide variety of geometries may be employed to reach different goals of wafer production. The geometry options are numerous and varied, and the Examiner has not, on this record, indicated that reaching Appellant’s recited solutions would be predictable. As such, we do not, on this record, conclude that moving Cho’s extension part 240 would be the type of mere optimization that is appropriately addressed by a result effective variable theory of obviousness. See KSR Int’l v. Teleflex Inc., 550 U.S. 398, 421 (2007) (explaining that an “obvious to try” rational of obviousness is appropriate “[w]hen there is a design need or market pressure to solve a problem and there are a finite number of identified, predictable solutions”). Appeal 2019-000413 Application 14/610,489 8 Because the Examiner has not adequately explained why, absent hindsight, a person of skill in the art would have had reason to reach the recitations of independent claims 11 and 13, we do not sustain the rejection of those claims. Because the Examiner’s treatment of dependent claims does not cure this error, we also do not sustain the Examiner’s treatment of the dependent claims on appeal. CONCLUSION In summary: Claims Rejected 35 U.S.C. § Reference(s)/Basis Affirmed Reversed 11, 12 103 Cho, Koshiishi, Ishibashi 11, 12 13, 14, 16– 18 13, 14, 16–18 Cho, Liu, Koshiishi, Ishibashi 13, 14, 16– 18 15 15 Cho, Liu, Koshiishi, Ishibashi, Kim 15 19 19 Cho, Liu, Koshiishi, Ishibashi, Choi 19 20 20 Cho, Liu, Koshiishi, Ishibashi, Choi, Yang 20 Overall Outcome 11–20 REVERSED Copy with citationCopy as parenthetical citation